720031 Kyrgyz Republic, Bishkek, 79 Isanova st, Business center “79”, office 02 info@bel.kg

Contract Electronics Manufacturing (CEM)

We always aim to hit the client's “target price” and strive to achieve the lowest possible final cost.

Order Placement


To place an order for assembly, the client must provide the following information:

  • A PCB project file in PCAD format (version no lower than 2000) or GERBER (all layers necessary for PCB production are required).
  • A complete BOM file specification (a full list of components) presented in the form of text information in Word or Excel format, or as a table according to ESKD.
  • The specification must contain the component’s position designation, component name, nominal value, quantity, and component package type.
  • An assembly drawing of the module or a well-readable assembly diagram for the installation of all components. It is best if the drawings are converted to image files.
  • Technical requirements for assembly, cleaning, and inspection, components installed after assembly, and components not to be installed (marked — do not install).
  • And most importantly — the “target price” i.e. the target price at which you are willing to purchase the product.

Order Placement

We will help you find the best electronic components for your needs!

Advantages of working with us


Minimal preparation costs for production

Minimal preparation costs for production

Precise order fulfillment deadlines

Precise order fulfillment deadlines

Flexible price optimization

Flexible price optimization

Installation of non-standard components

Installation of non-standard components

Possibility of assembling prototype boards

Possibility of assembling prototype boards

Full and partial assembly, functional testing

Full and partial assembly, functional testing

Our Production


Manufacturing capabilities:

  • All necessary warehouse distributions.
  • Kanban production.
  • Just-In-Time (JIT) production.
  • Automated assembly of large volumes.
  • Automated Surface Mount Technology (SMT) installation and equipment.

Technological capabilities:

  • Chemical cleaning.
  • Water-soluble chemistry.
  • SMT chemistry.
  • Wave soldering.
  • Multilayer boards with final coatings including HASL, nickel-gold, and immersion tin.
  • Ball Grid Array (BGA) repair, reballing, and inspection services using X-ray equipment. Consulting on packaging.

In terms of contract manufacturing, we are ready to take on the entire range of work, starting from supplying boards and components and ending with packaging the finished product. All work is carried out under the supervision of the Quality Control Department.

Our Production

Any other questions?


Managers of our company will answer your questions and calculate the cost of services.

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